公司新闻-泰微科技（珠海）有限公司|半导体领域纳米级检测设备专家

News

Contact

Tel：0756-6180852

Sales Hotline：13798987404

Email：yuanyu_wei@test-way.com

Address：珠海市香洲区福田路10号博杰园区1栋

Mar 2026 | Wafer Laser Marking Machine Put into Commercial Delivery"

2026-03-04

First unit delivery of Wafer Laser Marking Machine for precise laser engraving of wafer ID and traceability codes, forming an integrated solution of dicing, marking and inspection.…
Dec 2025 | Self-developed Wafer Laser Dicing Machine Delivered"

2025-12-12

First unit delivery of self-developed Wafer Laser Dicing Machine, expanding business scope from inspection equipment to wafer processing equipment.…
Oct 2025 | Full-Range Surface Defect Inspection Equipment Released"

2025-10-08

First unit delivery of high-precision Surface Defect Inspection Equipment, completing the full-process defect inspection product portfolio for wafers and substrates.…
Apr 2025 | Ceramic Substrate Automatic Size Sorter Delivered"

2025-04-15

First unit delivery of fully automatic Ceramic Substrate Size Sorting Machine, integrating automatic dimension measurement and grading sorting.…
Feb 2025 | Ceramic Substrate Warpage Measuring Machine Launched"

2025-02-12

First unit delivery of Ceramic Substrate Warpage Measuring Machine for high-precision warpage detection of packaging substrates.…
Aug 2024 | Core Wafer Defect Tester Mass Production & Delivery"

2024-08-11

First unit delivery of general-purpose Wafer Defect Inspection Tester (Final AOI), compatible with final inspection of SiC, InP, GaAs, GaN and other compound semiconductor wafers.…
Dec 2023 | Ceramic Substrate Inspection Equipment 1st Shipment"

2023-12-04

Expanded to packaging substrate field; first unit of Ceramic Substrate Inspection Equipment delivered.…
Nov 2023 | Wafer Flatness Inspection Equipment 1st Shipment

2023-11-11

First unit delivery of Wafer Flatness Inspection Equipment, providing high-precision measurement of flatness and warpage for substrate outgoing quality control.…
Aug 2023 | Angel Round Financing Closed

2023-08-19

Completed Angel Round financing, empowering product iteration, capacity expansion and R&D team scaling-up.…
Jun 2023 | Wafer Dicing Defect Inspection Equipment 1st Shipment

2023-06-04

First unit delivery of Wafer Dicing Defect Inspection Equipment, realizing full inspection of chipping, cracking and edge defects after wafer dicing process.…
Oct 2022 | TEST-WAY Officially Founded

2022-10-12

English：Zhuhai TEST-WAY Technology Co., Ltd. officially founded, focusing on import substitution of semiconductor metrology & inspection equipment.…
Dec 2021 | 1st Equipment Successfully Delivered

2021-12-09

English：First unit of self-developed Wafer Dislocation Inspection Equipment delivered to customer, breaking domestic gap in microscopic dislocation detection equipment for compound semiconductor wafe…
Jan 2020 | Project Initiation & Technical Deployment

2020-01-04

English：Market research completed, R&D kicked off for semiconductor wafer inspection equipment, project incubated within Bojay Technology.…