Wafer Laser Dicing Equipment

Wafer Laser Dicing Equipment	PLD100
Product Description	The equipment adopts a high peak power ultraviolet picosecond laser and German imported scanning galvanometer. It features a shock-absorbing sheet metal machine base together with a granite surface plate, ensuring overall stability during semiconductor wafer dicing.
Applications	Designed for processing metals, semiconductor wafers and hard brittle materials, as well as etching scribing processes including dicing, scribing and drilling.
Processing Method	Dicing with picosecond ultraviolet laser
Applicable Materials	InP / Ge / GaAs / GaSb, etc.
Effective Travel Range	X-axis: 150 mm; Y-axis: 90 mm
Positioning Method	Fixture positioning, manual loading & unloading
Repeatability	≤±5um
Chipping Size	＜20μm