Wafer Laser Marking Equipment

晶圆激光打标设备1

Wafer Laser Marking Equipment	PLI100
Product Description	This equipment performs laser marking and character engraving on wafer surfaces to enable process traceability and quality control
Applications	Marking and character engraving for substrate wafers and epitaxial wafers.
Processing Method	Non-contact laser processing, stress-free and wear-free
Applicable Materials	InP / GaAs / Ge / GaSb, etc.
Marking Content	Numbers, letters, symbols, etc.; SEMI standard font library (custom fonts expandable)
Loading & Unloading	Automatic robotic transfer system
Loading Station	Supports 2-inch, 3-inch, 4-inch, 6-inch wafer cassettes; capable of holding 3 wafer cassettes simultaneously
Mark Code Generation	Automatically generate Wafer ID including serial number