Wafer Dicing Defect Inspection Equipment

Wafer Dicing Defect Inspection Equipment	WID100
Product Description	Inspection equipment targeting the wafer packaging sector. Core features: 1.Core technology: Integrated high-precision optical system, high-precision motion system and intelligent AI algorithms 2. Inspection capability: Accurately identify wafer surface defects and dicing defects
Applications	Conduct comprehensive visual defect inspection on scribe lines and die edges after wafers are cut by laser or blade
Inspection Method	Non-contact automated vision inspection
Applicable Materials	Integrated circuit wafers
Camera Specification	4K 5 μm line scan camera
Objective Magnification	1X, 5X, 10X optional
Pixel Resolution	1 μm (based on 5X objective)
Detection Precision	1 μm (based on 6X objective)