Wafer Morphology Inspection Equipment (Three-Point Support)

Wafer Topography Inspection Equipment (Three-Point Support)	WIS100
Product Description
Applications
Inspection Method	Non-contact optical sensor
Applicable Materials	Silicon and compound semiconductor wafers (SiC, InP, GaAs, GaSb, etc.)
Holding Method	3-point support
Wafer Size	2~8 inch, expandable to 12 inch (12-inch version requires custom development)
Repeatability	≤1μm 3sigma (TTV、BOW、WARP）
Measurement Precision	0.1μm
Output Format	Intuitive data display with 2D or 3D mapping