Wafer Flatness Inspecting Equipment (Flat Support)

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Wafer Topography Inspection Equipment (Full-flat support)	WIS100
Product Description	This non-contact optical wafer topography metrology system targets the grinding and polishing processes of compound semiconductor wafers. It accurately measures geometric parameters including wafer thickness, bow, global and local flatness.
Applications	1.Substrate manufacturing processes: Monitor TTV、BOW, WARP and LTV after dicing, grinding and polishing of SiC, GaAs, InP and other substrates to ensure wafer uniformity 2.Pre-epitaxy quality inspection: Poor flatness leads to uneven epitaxial layer thickness. The system screens out defective wafers in advance 3.The equipment supports process monitoring and outgoing inspection for the above workflows
Inspection Method	Non-contact optical sensor
Applicable Materials	Compound semiconductor wafers (SiC, InP, GaAs, GaSb, etc.)
Holding Method	Flat support with vacuum chucking
Wafer Size	2~8 inch, expandable to 12 inch (12-inch version requires custom development)
Repeatability	0.1μm 3sigma (TTV、LTV)
Measurement Precision	0.1μm
Output Format	Intuitive data display with 2D or 3D mapping