Wafer Dislocation Inspection Equipment

Wafer Dislocation Inspection Equipment	WIL100
Product Description	This semi-automated system integrates a high-resolution optical microscopy system and intelligent image recognition algorithms. It is specially designed for rapid detection and automatic counting of dislocation density on semiconductor substrate materials. Featuring user-friendly operation, it supports both precise manual positioning and automatic batch scanning. The system effectively replaces manual visual inspection and greatly improves inspection efficiency and result consistency.
Applications	1.Incoming material inspection and outgoing quality control for compound semiconductor substrate production lines 2.Quantitative analysis of dislocation density in material R&D laboratories 3.Process quality monitoring during semiconductor manufacturing
Inspection Method	1.Adopts high-speed line-scan brightfield illumination technology paired with a high-precision auto-focus system to perform continuous scanning imaging on wafer surfaces. 2.Utilizes self-developed defect recognition algorithms to automatically mark, count, classify and statistically analyze dislocation pits.
Applicable Materials	GaAs, InP, Ge single-crystal substrates; compatible with 2~8 inch wafers
Camera Specification	4K 5 μm line scan camera
Objective Magnification	10X
Pixel Resolution	0.5μm
Focus Mode	Auto-focus